IPC-9502電子元件的印制板組裝焊接過導(dǎo)則

IPC-CM-770印支板元件安裝導(dǎo)則

IPC-A-610印制板組裝件驗(yàn)收條件   印制板組裝件驗(yàn)收條件

IPC-SM-780以表面安裝為主的元件封裝及互連導(dǎo)則

IPC-SM-782表面安裝設(shè)計(jì)及連接盤圖形標(biāo)準(zhǔn)(包括修訂1和2)

IPC 9701   Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
表面安裝錫焊件性能試驗(yàn)方法與鑒定要求


IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
非密封固態(tài)表面貼裝器件濕度/再流焊敏感度分類

IPC/JEDEC J-STD-033A Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
對(duì)濕度、再流焊敏感表面貼裝器件的處置、包裝、發(fā)運(yùn)和使用

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