中國北京，2024年2月23日——Analog Devices, Inc. (Nasdaq:  ADI)宣布已與全球領(lǐng)先的專用半導(dǎo)體代工廠臺積電達(dá)成協(xié)議，由臺積電在日本熊本縣的控股制造子公司——日本先進(jìn)半導(dǎo)體制造公司(“JASM”)提供長期芯片產(chǎn)能供應(yīng)。

基于ADI與臺積電30多年的合作關(guān)系，此次達(dá)成的協(xié)議為ADI擴(kuò)大先進(jìn)制程節(jié)點的產(chǎn)能提供了更多選擇，以更好地滿足ADI業(yè)務(wù)中關(guān)鍵平臺的需求，包括無線BMS (wBMS)和千兆多媒體串行鏈路(GMSL?)應(yīng)用。雙方的共同努力進(jìn)一步鞏固了ADI強(qiáng)韌的混合制造網(wǎng)絡(luò)，有助于降低外部因素影響、快速擴(kuò)大產(chǎn)能和規(guī)模，以滿足客戶需求。

ADI全球運營與技術(shù)執(zhí)行副總裁Vivek Jain表示：“我們的混合制造網(wǎng)絡(luò)有助于為客戶提供競爭優(yōu)勢。通過與臺積電合作，我們可以為客戶提供更富韌性的供應(yīng)鏈，更快速地響應(yīng)客戶需求及不斷變化的市場條件，并將投資重點放在能夠造福社會和地球的創(chuàng)新型制造解決方案上?！?

臺積電北美業(yè)務(wù)拓展執(zhí)行副總裁Sajiv Dalal表示：“臺積電致力于幫助客戶滿足其長期產(chǎn)能需求。我們很高興能夠擴(kuò)大與ADI的持續(xù)合作，通過強(qiáng)勁的制造能力，實現(xiàn)堅定而充滿活力的半導(dǎo)體創(chuàng)新之旅?！?

如需了解ADI強(qiáng)韌的混合制造網(wǎng)絡(luò)的更多信息，請訪問www.analog.com/cn/who-we-are/resilient-hybrid-manufacturing.html。

關(guān)于ADI公司

Analog Devices, Inc. (NASDAQ: ADI)是全球領(lǐng)先的半導(dǎo)體公司，致力于在現(xiàn)實世界與數(shù)字世界之間架起橋梁，以實現(xiàn)智能邊緣領(lǐng)域的突破性創(chuàng)新。ADI提供結(jié)合模擬、數(shù)字和軟件技術(shù)的解決方案，推動數(shù)字化工廠、汽車和數(shù)字醫(yī)療等領(lǐng)域的持續(xù)發(fā)展，應(yīng)對氣候變化挑戰(zhàn)，并建立人與世界萬物的可靠互聯(lián)。ADI公司2023財年收入超過120億美元，全球員工約2.6萬人。攜手全球12.5萬家客戶，ADI助力創(chuàng)新者不斷超越一切可能。更多信息，請訪問www.analog.com。

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Forward-Looking Statements 

This press release contains forward-looking statements, which address a variety of subjects including, for example, our statements regarding our long-term wafer capacity supply arrangement with TSMC and JASM; our hybrid manufacturing network; and other future events. Statements that are not historical facts, including statements about our beliefs, plans and expectations, are forward-looking statements. Such statements are based on our current expectations and are subject to a number of factors and uncertainties, which could cause actual results to differ materially from those described in the forward-looking statements. The following important factors and uncertainties, among others, could cause actual results to differ materially from those described in these forward-looking statements: economic, political, legal and regulatory uncertainty or conflicts; changes in demand for semiconductor products; manufacturing delays, product and raw materials availability and supply chain disruptions; products that may be diverted from our authorized distribution channels; changes in export classifications, import and export regulations or duties and tariffs; our development of technologies and research and development investments; our future liquidity, capital needs and capital expenditures; our ability to compete successfully in the markets in which we operate; and security breaches or other cyber incidents. For additional information about factors that could cause actual results to differ materially from those described in the forward-looking statements, please refer to our filings with the Securities and Exchange Commission, including the risk factors contained in our most recent Annual Report on Form 10-K. Forward-looking statements represent management’s current expectations and are inherently uncertain. Except as required by law, we do not undertake any obligation to update forward-looking statements made by us to reflect subsequent events or circumstances.

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